หางาน สมัครงานอัปเดตล่าสุดวันนี้

Responsibilities:
1. PCBA laser cutting , ultrasonic cleaning, laser marking, heat sink & cover plate assembly, PCBA board/ mother board splicing, TOSA/BOSA assembly process control and maintenance.
2. Modification of MOI and confirmation of specifications.
3. Regularly provide product yield and efficiency improvement plans.
4. NPI products transferred to Thailand factory to undertake, trial production report & problem tracking.
5. For customer complaints & audit problems, give root causes and improvement plans.
6. Tolerance analysis; fixtures Measure, verify and accept.

1.College degree or above, majors in semiconductor physics and mechanics are preferred.
2.3 years and above in assembly, optical communication or electronic semiconductor industry.
3.Understand the principles of assembly process.
4.Have the epoxy dispensing experience and knowledge related to glue curing conditions.
5.Proficient in using solid work, Tolerance measurement and Microsoft Office (Excel, PowerPoint), etc.
6.Have defective analysis methods, QC seven analysis methods or W1H and other analysis methods, analyze and communicate to solve problems; write and organize relevant improvement reports.
7.Experience in similar electronics industry.